The evolution of wireless communications has been driven by advancement in multiple access techniques for over 50 years. This tutorial offers a comprehensive review of key multiple access techniques that have shaped modern connectivity. https://bit.ly/3ByoFrd Yuanwei Liu, Chongjun Ouyang, Zhiguo Ding, and Robert Schober, "The Road to Next-Generation Multiple Access: A 50-Year Tutorial Review," in Proceedings of the IEEE, vol. 112, no. 9, pp. 1100-1148, Sept. 2024 #NOMA #NGMA #MultipleAccess #WirelessCommunications
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For over 100 years, Proceedings of the IEEE has been the leading journal for engineers looking for in-depth tutorial, survey, and review coverage of the technical developments that shape our world.
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http://proceedingsoftheieee.ieee.org
External link for Proceedings of the IEEE
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Our latest special issue explores the state-of-the-art research on next-generation multiple access in different disciplines. https://bit.ly/4fabZVh #NGMA #NOMA #6G
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Proceedings of the IEEE reposted this
Have you visited the newly updated TryEngineering.org website yet? Perfect for #educators, volunteers, and anyone involved in #STEM outreach, the redesigned site offers: 🔍 Enhanced search functionality 📚 Themed and partner resource collections 🌍 An interactive global events map 📰 News, spotlights, #lessonplans, and all your favorite #resources Visit TryEngineering.org today and join us in inspiring the next generation of engineers! 🚀
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Researchers at City University of Hong Kong present a comprehensive study encompassing the latest developments in 3D printing technologies for terahertz antenna fabrication and design, highlighting future materials and printing technology that can be used to create sophisticated terahertz antennas and systems. https://bit.ly/3CTiX3r Gengbo Wu, Jin Chen, CHENFENG YANG, Ka Fai Chan, Mu Ku Chen, Din Ping Tsai, and Chi Hou Chan, "3-D-Printed Terahertz Metalenses for Next-Generation Communication and Imaging Applications," in Proceedings of the IEEE, vol. 112, no. 8, pp. 1033-1050, Aug. 2024 #TerahertzCommunications #3DPrinting
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Intelligent surfaces are envisioned to enable a wide range of applications for future 6G scenarios. This comprehensive survey explores their recent development and advances. https://bit.ly/3CV8nsF Qingqing Wu et al., "Intelligent Surfaces Empowered Wireless Network: Recent Advances and the Road to 6G," in Proceedings of the IEEE, vol. 112, no. 7, pp. 724-763, July 2024 #Intelligentsurfaces #6G #wirelessnetworks
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Ultradense cell-free massive #MIMO is a promising technology poised to meet the future demands of ubiquitous connectivity and surging data traffic in #6G. Learn more about this technology and the key questions surrounding its future deployment: https://bit.ly/40UboUh Ngo Quoc Hien, Giovanni Interdonato, Erik G. Larsson, Giuseppe Caire and Jeff Andrews, "Ultradense Cell-Free Massive MIMO for 6G: Technical Overview and Open Questions," in Proceedings of the IEEE, vol. 112, no. 7, pp. 805-831, July 2024
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Emerging additive manufacturing technologies are reshaping the design capabilities and functionalities of contemporary electronic devices. This article presents a comprehensive review of the emerging 3D/4D printing and origami techniques using multimaterials and shape-memory materials for designing functional electronic components and devices. https://bit.ly/3V5ZxyO Yang Yang, Zhiwei Yin, Xuyi Zhu, Hani Al Jamal, Xiaojing Alex Lv, Kexin Hu, Marvin Joshi, Nathan Wille, Mengze Li, Bing Zhang, Zhen (Jeff) Luo, Shlomo Magdassi, and Manos Tentzeris, "A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation," in Proceedings of the IEEE, vol. 112, no. 8, pp. 954-999, Aug. 2024 #3DPrinting #4DPrinting #AddiviteManufacturing
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How do #AI / #MachineLearning synergistically interact with #WirelessCommunications to improve system performance? Learn about practical tips for realizing these performance gains while training AI/ML models in this article: https://bit.ly/3CtQr8x Zhijin Qin, Le Liang, Zijing Wang, Shi Jin, Xiaoming Tao, Wen Tong, and Geoffrey Ye Li, "AI Empowered Wireless Communications: From Bits to Semantics," in Proceedings of the IEEE, vol. 112, no. 7, pp. 621-652, July 2024.
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We are excited to announce the recipient of our 2024 Best Paper Award: "Training Spiking Neural Networks Using Lessons From Deep Learning" in Proceedings of the IEEE, vol. 111, no. 9, pp. 1016-1054, Sept. 2023 Congratulations to the authors: Jason Eshraghian, Max Ward, Emre Neftci, Xinxin Wang, Gregor Lenz, Girish Dwivedi, Mohammed Bennamoun, Doo Seok Jeong, and Wei Lu! Drawing insights from deep learning, circuit design, neuromorphic engineering, and medical AI, this tutorial offers an interdisciplinary perspective on how to apply modern deep learning principles to train networks of spiking neurons. Read this paper at https://bit.ly/48w1B8g
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Our new special section covers state-of-the-art multimaterial 3-D printing electronics, emerging 4-D printing concept, and guideline for 4-D electronic component designs. https://bit.ly/3Avc8ED #3DPrinting #4DPrinting
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