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The final chapter of our HBM4 blog series is here: Redefining XPU Memory for AI Data Centers Through Custom HBM4! In part 3, we take a closer look at how custom HBM designs, combined with advanced die-to-die interfaces and 2.5D packaging, address critical challenges in AI and HPC workloads. These innovations solve memory bottlenecks, delivering ultra-high bandwidth, lower latency, and improved power efficiency. Don't miss the video in the blog featuring Principal Product Marketing Manager Archana P Cheruliyil where she shares expert insights into the evolution of HBM technology and its pivotal role in shaping AI data centers. Read the blog and watch the video now:https://lnkd.in/eQvHqBva #HBM4 #AI #Innovation #DataCenters #AI #Connectivity #AlphawaveSemi #ConnectivityIP #ConnectivitySolutions #Chiplets #Connectivity #CustomSilicon #Silicon

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B Dweik

Ex-Tech Exec, Engineer, Experienced Passive Real Estate Investor | Co-Founder of Bluestone Flagship Investors | Empowering Busy Professionals to Invest alongside in Well Vetted Projects

1w

Clever solution, pretty much resembles Micron HMC, with improvements!

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