We are excited to continue week 3 of #EbandXplain series - a 5 week series where we will explore E-Band (71 -86 GHz) technology and its transformative impact on our digital world. This week we will explore current E-band architecture and the implementation of E-Band to overcome its technical challenges. A typical RF radio comprise of the baseband module and the radio frontend. Crucially, the frontend contains critical passive components that play an important role in the link performance. The E-Band radio architecture must be designed to handle the high-frequency signals, which requires the use of specialized components such as high-frequency amplifiers, mixers, and filters. Due to the short wavelengths, components can be made smaller but require more precise manufacturing. Advances in frontend manufacturing and design has pushed the architecture to be more power efficient, and practical for widespread adoption. By adopting a holistic approach to system design and focusing on front-end efficiency we can overcome the power limitations of E-band semiconductor devices and maximize link performance. Stay tuned to next week where we will explore the real world use case of this revolutionary technology! #EBand #wireless #5g #6g #hardware
Om oss
We develop wireless hardware solutions that offer best-in-class performance, size and weight by combining scalable manufacturing and cutting-edge design techniques. We offer standalone passive components and integrated wireless modules for E-band and above that are up to 100 times smaller and lighter than existing alternatives.
- Webbplats
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https://www.terasi.io
Extern länk för TERASi
- Bransch
- Trådlösa tjänster
- Företagsstorlek
- 2–10 anställda
- Huvudkontor
- Stockholm
- Typ
- Privatägt företag
- Grundat
- 2020
Adresser
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Primär
Östermalmsgatan 26a
Stockholm, 11426, SE
Anställda på TERASi
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Per Björklund
Angel Investor and Startup Advisor
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Ingrid Nordmark
Board Member I Interim manager I Advisor
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James Campion
Co-founder & CEO at TERASi | Compact, lightweight, efficient hardware for 5G/6G
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Klaus Grössinger
General Partner at Onsight Ventures | Investing in the Future of Computing & Life Science
Uppdateringar
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We are delighted to announce this European Space Agency - ESA contract for project TABASCO. Our goal is to deliver compact, steerable payloads for communication and sensing using D-band phased arrays. This technology is expected to play a major role in future 6G networks. Thanks to Rymdstyrelsen for supporting this activity and our commercial development. #5g #6g #antenna #space #satellite
6G in space: coming soon to a satellite near you! We are proud to announce that TERASi has secured a contract from European Space Agency - ESA for early stage development of next gen communication and sensing based on key 6G spectrum. We aim to solve the limitations of existing optical intersatellite links by driving a large reduction in payload size and weight by using RF electronics instead of photonics. The massive bandwidth available at D-band ensures capacities are kept high. This will make it possible to increase mission lifetime, decrease power consumption / launch costs and bring new levels of capacity to smallsats + cubesats. What could this enable? Here are a few possibilities: - connected datacenters in space - debris detection networks - distributed remote sensing using giga constellations - unlocking new data sources for environmental monitoring D-band (110-170 GHz) is set to play a key role in 6G due to the large available bandwidth which can support 100 Gbps links. Although it's still early doors for 6G players such as Nokia have already launched D-band products, highlighting the potential of this band for future telecoms networks. By bringing this capability to space TERASi aims to add a new level of connectivity to the satellites of the future. Thanks to Rymdstyrelsen for supporting this activity and helping to push Swedish technology to new realms. More details will follow at a later date. #6g #5g #space #hardware #telecom #satellite
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E-band is a game-changer for wireless connectivity; With its high frequency and wide bandwidth, E-band can help increase capacity and reduce latency. However, it also comes with its own set of technical challenges. We are continuing on week 2 of our #EbandXplain series - a 5 week series where we will explore E-Band (71 -86 GHz) technology and its transformative impact on our digital world. Last week, we discussed the motivations for using E Band. This week we will explore its characteristics and ways to deploy E-Band systems effectively. E-Band signals are directional and have a relatively short range, typically up to 2-3 km, because they are sensitive to atmospheric conditions such as fog, rain, and humidity. However, this short range also provides a natural barrier against interference from other wireless devices and networks, making E-Band a secure and reliable choice for certain applications. By shrinking E Band components and improving its availability, we can unlock the full potential of high-speed wireless connectivity, enabling faster, more reliable, and more widespread access to data and services. #wireless #hardware #5g #6g #Eband
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Unlocking the power of E-band We are excited to kick off Week 1 of #EbandXplain series - a 5 week series where we will explore E-Band (71 -86 GHz) technology and its impact on our digital world. This week we will dig into the growing demand for high-speed wireless connectivity, the limitations of current technologies and how E-band can help bridge the gap. E-band is primarily used in wireless backhaul, where it can offer capacities of over 20 Gbps: enough to stream uncompressed 4K video in real time! This capacity makes E-band ideal for transporting large amounts of data between two locations. E-band is currently the fastest growing sector of the wireless backhaul market with reported growth rates of over 10%. This capacity will be needed to provide the exponential growth in wireless data traffic, which is expected to triple by 2030. So what’s the catch? Join us as we dive in to the hardware problems that limit current solutions and how new innovations in system design, integration and packaging can unlock the true power of E-band. #EBand #wireless #5g #6g #hardware
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We are thrilled to share that TERASi has been named one of Sweden's Top 33 startups by Ny Teknik! NyTeknik is Sweden's leading technology & IT newspaper. Its annual #33listan lists Sweden's 33 hottest startups across a range of sectors, which are judged based on their technical prowess and international market potential. 2024 marks TERASi's first inclusion in the prestigious list. Check out the full list here: https://lnkd.in/dw2hvGBP
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TERASi has been awarded a 4 MSEK grant from Vinnova to support the development of our next generation 5G/6G radio products! The grant is part of Vinnova's "deeptech acceleration" program which supports technical and commercial development at innovative SMEs. The project runs for two years, with the end goal of bringing complete radio modules to the wireless backhaul and SATCOM markets. #grant #5g #6g #hardware #innovation #satcom #backhaul
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Fresh off the production line: new E-band filter prototypes! These filters bring best-in-class performance to next-gen communications and radar applications in a compact, lightweight package. They are the first in a series of new passive components to be released over the coming months. Full details coming soon. Want to learn more? Contact our sales team at sales@terasi.io #wireless #eband #filter #hardware #prototype #radar
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Production is in full swing. New products and demonstrators for E-band and D-band coming soon. Watch this space! #hardware #prototype #5g #6g
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TERASi omdelade detta
Excited to share this customer story from our partners Finetech! Their incredible die-bonders are key to our SiP solutions at TERASi. Check out the article to get a behind-the-scenes peek of 5G/6G innovation in action (a.k.a. putting very, very small things inside slightly bigger things). https://lnkd.in/dqwS4_Ku #wireless #bonder #5g #6g #innovation
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Our packaging dept. is now open for business. Thank you Finetech!
Last week saw the successful installation of a key tool for our future product roadmap: a state of the art die-bonder from Finetech at TERASi's fab. These tools are marvels of engineering and precision mechanics. They allow you to place miniscule chips with a resolution smaller than a human blood cell (~3-5 um) and then press them together with forces up to 50 kg! This new tool will allow us to build complete system-in-package modules for 5G/6G applications as well as simplifying the production of our existing components. A huge thank you to the entire Finetech team for the quality of their service and for making such amazing tools, especially Thomas M. and Aliaksandr Yermak who managed the procurement process and answered our endless questions! #production #tooling #semiconductors