Toppan Group

H2L, inc., NTT DOCOMO, Inc., TOPPAN Inc., Toyota Motor Corporation Frontier Research Center, Mizuno Corporation, and Mitsubishi Research Institute, Inc. joined the “Human Augmentation Consortium1,2" on Tuesday, December 17, 2024, to utilize human augmentation technology that enhances human senses and movements through networks in various fields, aiming to solve societal issues. Read more at: https://lnkd.in/gaiSMnnK

TOPPAN Holdings has been named to the Dow Jones Sustainability World Index (DJSI World) for the second consecutive year. DJSI World is an environmental, social, and governance (ESG) investing index provided by S&P Global. As one of the longest-running and best-known sustainability indexes, DJSI World is widely recognized and trusted by experts the world over. Companies’ ESG performance is evaluated in a stringent Corporate Sustainability Assessment (CSA) of more than 13,000 listed entities around the world, with those demonstrating outstanding sustainability performance being selected to the index. A total of 321 companies feature in the 2024 index, including 37 from Japan. Read more at: https://lnkd.in/gX6QEsfM

TOPPAN Holdings Inc. has entered into an agreement with Sonoco Products Company, a global leader in high-value sustainable packaging, to acquire Sonoco’s Thermoformed & Flexible Packaging (TFP) business for approximately $1.8 billion. Read more at: https://lnkd.in/gvsnD9-Q

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TOPPAN Inc. has announced its participation in US-JOINT from November 18. US-JOINT is a US-Japan consortium for next-generation semiconductor packaging established in July this year and spearheaded by Resonac, a leading manufacturer of semiconductor back-end process materials. TOPPAN will participate as a packaging substrate manufacturer and aim to contribute to the evolution of next-generation semiconductor packaging technology through involvement in the development of mounting technologies and the creation of a next-generation packaging evaluation platform in the US. Read more at: https://lnkd.in/g2-fFvDR

TOPPAN Inc. will participate in SEMICON Japan 2024, which be will held from December 11 through 13 at the Tokyo Big Sight exhibition center. SEMICON Japan is an international event for the electronics manufacturing sector, covering areas from manufacturing technology, equipment, and materials in the semiconductor industry to smart applications such as automobiles and IoT devices. The TOPPAN Group booth at SEMICON Japan 2024 will showcase a wide range of solutions, from products used in front-end semiconductor manufacturing processes, such as design and photomask production, to those used in back-end processes, such as Flip Chip-Ball Grid Array (FC-BGA) substrates and next-generation semiconductor packaging. https://lnkd.in/gKjTfAUc

TOPPAN Inc. and FOSHAN TAJIE DECORATION MATERIAL CO., LTD. will participate in Guangzhou Designweek 2024, which will be held from December 6 to 9 in Guangzhou, China. TOPPAN caters to global markets in its décor materials business, designing and developing products matched to the quality requirements and environmental needs of each region. As a showcase for the Chinese interior industry, at Guangzhou Designweek TOPPAN will present interior design and décor materials fusing modern designs with those that draw beauty from tranquility, typified by Japanese minimalism. Coinciding with the event, TOPPAN will also launch a redesigned global website for its Environmental Design business. Global website: https://lnkd.in/gziTSRvd Read more at: https://lnkd.in/gt4trVVB

TOPPAN Holdings developed its first-generation 3D ToF (Time of flight) sensor1 for robotics in 2023, using hybrid ToF™2 technology to enable long-range measurement, tolerance to outdoor environments, high-speed sensing, and simultaneous use of multiple devices. TOPPAN Holdings has now further enhanced the first-generation’s high-speed imaging and high-precision range measurement to develop a new model of the 3D ToF sensor with a more compact form factor and lower power consumption. This will contribute to higher 3D sensing accuracy for robotics and spatial mapping, expanding the range of potential applications. Samples of the new sensor will be available from May 2025, with the launch of mass production scheduled for October. The new 3D ToF sensor will be on display in the TOPPAN Group booth (booth 47) at the International Technical Exhibition on Image Technology and Equipment 2024, which will be held at the Pacifico Yokohama in Yokohama, Japan, from December 4 to 6 this year. Read more at: https://lnkd.in/gFFcEgPs

[AIPIA World Congress in Amsterdam]  Don't miss our speech today at the AIPIA & AWA Smart Packaging World Congress 2024 !! Takuya Onuki and Tomoaki A. will be making a presentation titled ''Combining Digital IDs and IoT Platforms with Innovative Integration of NFC Tags into Packaging to Create Dynamic Phygital Experiences'' from 12:00 to 12:30 p.m. at CALLA 2, Hotel Novotel Amsterdam City. We look forward to seeing you at the venue! Visit us at AIPIA https://lnkd.in/gNHWaSHk 📅 November 18th-19th, 2024 📍 Hotel Novotel Amsterdam City https://lnkd.in/gnUwBqjt #AIPIA #RFID #NFC

【Automotive Interiors Expo 2024】 Today was the final day exhibiting in Automotive Interiors Expo 2024. Thank you to all of you coming to our TOPPAN booth! See you next time! Automotive Interiors Expo