WIN SOURCE’s Post

📈 Weekly Industry Highlights from Win Source (Week 3 of November 18 - 22) Keep up with the latest trends in the electronics industry! Here are this week's top highlights: - #TSMC, #Samsung, and #Intel Expand Semiconductor Production to Meet Global Demand - #Infineon and #Marelli Collaborate on Advanced Zone Control Technology for Automotive Safety - #CGD and #Qorvo Partner to Revolutionize Motor Control for EVs and Industrial Machinery - #Melexis Launches Advanced Sensors and Microprocessors for Automotive Industry - #Pi Unveils 1700V Switcher IC for High-Voltage Power Electronics - #TexasInstruments Launches Edge AI Microcontrollers for Real-Time Data Processing - #Renesas Electronics Releases First Automotive SoC Using 3nm Technology  - #TexasInstruments Opens Distribution Center in Europe to Improve Logistics - #ONSemiconductor and #WürthElektronik Develop High-Precision Virtual Design Tools - #Solidigm, an #SKHynix Subsidiary, to Launch Highest Capacity Enterprise SSD in 2025 Explore more on our blog 👉https://lnkd.in/gXhk54eU Discover the latest tech with Win Source! 💻⚡ #WINSOURCE #electronics #LP5Camm2 #ESSD #3nm #SoC #Automotive #powerelectronics #EVs

📈 Weekly Industry Highlights from Win Source (Week 4 of September 23-27)  Keep up with the latest developments in the electronics industry! Here are the key highlights from this week: - #AMD Unveils Mi325x AI Chip   - #Microchip Achieves Functional Safety Certification for PolarFire FPGA Series   - Silicon Carbide Integration in Traditional Fabs   - Solid State Circuit Breakers: Enhancing Safety in HVDC Power Systems   - #IPC Releases White Paper on Advanced Packaging and Integration Strategies   - #Intel CEO Outlines Vision for Innovation and Supply Chain Resilience   - #CE3 Expands Soldering Solutions for High-Precision Electronics Manufacturing   - #Yageo and #Xsemi Launch Advanced MOSFETs for Enhanced Power Management   - #Honeywell and #Samsung Join Forces to Reduce Carbon Emissions in Power Plants   - #ByteDance Partners with #TSMC to Develop Proprietary AI Chips Explore more on our blog 🔗 https://lnkd.in/ggunkcx2 Discover the latest tech with Win Source! 💻⚡ #WINSOURCE #electronics #Mi325x #PolarFire #FPGAChips #SiliconCarbide #SiC #Semiconductors #MOSFET 

When AND gate (X.Y) and NAND gate (X.Y)' meet in an electronic chip. #logiccircuit #gates #electronic #electronicchip

🔍🔬 Step into the World of Vertical and MEMS Probes Micro-Cutting for Semiconductors Testing Industry ⚡ In the fast-paced realm of electronics, precision is not just desirable – it's non-negotiable. As you navigate the intricate landscape of semiconductor testing, you know that achieving the perfect balance of contact force, current capacity, and pitch is paramount. That's where we come in. At Posalux, we're not just aware of your needs – we understand them. 🟢🟩 Let's Talk Vertical and MEMS Probes Micromachining: Imagine a world where every probe, every micron, matters. Your advanced probe cards, boasting thousands of vertical or MEMS probes, are your ticket to unlocking the true potential of memory and non-memory microprocessors on a wafer level. From DRAM to NAND to SoC, we've got you covered with our micromachining solutions. But it's not just about the technology – it's about understanding your world. 🔬 Experience High-Quality Vertical and MEMS Probes Micro-Cutting. Picture this: precision so fine, it's almost an art form. With our expertise, we slice through materials like copper, palladium, and iridium with unparalleled accuracy. Whether it's a cutting width of 20 µm or less or crafting probes of any length and shape, we're here to make your vision a reality. Your needs are our priority. Your challenges, our fuel. Ready to elevate your semiconductor testing game? Join us on this journey of precision, reliability, and innovation 🚀 Discover the Posalux difference today: https://buff.ly/3wP9Yx9 #PrecisionMicroMachining #SemiconductorTesting #VerticalProbes #MEMSProbes ProbesMicroCutting

Application of Nanowire in semiconductor and high performance flexible electronics

#SiC #MOSFETs can lower switching losses, but achieving high switching speeds during power module operation is challenging. So have SiC MOSFET packaging challenges been solved? #electroniccomponents #chip #semiconductor #electronics #perceptive #electroniccomponents #semiconductorelectronic   #powermodule learn more: https://lnkd.in/gQY_GmBr

Producing MOSFETs with channel lengths much smaller than a micrometre presents a significant challenge in semiconductor device fabrication, hindering the advancement of integrated circuit technology. Despite improvements like ALD processes for small components, the small size of MOSFETs, less than a few tens of nanometers, poses operational challenges. The drive to make devices smaller has led to more complex junction designs with higher doping levels, shallower junctions, and "halo" doping to reduce drain-induced barrier lowering. However, these complexities result in increased junction leakage as traditional annealing steps are reduced, allowing for the retention of complex junctions. Moreover, heavier doping contributes to thinner depletion layers and more recombination centers, consequently causing higher leakage current. These factors highlight the intricate balance required in semiconductor fabrication to address the operational issues arising from the miniaturization of MOSFETs. Wikipedia contributors. (2024, June 1). MOSFET. Wikipedia. https://lnkd.in/gHiscfH2 Anarchy 7 wdyt? NVIDIA Google Apple Tesla

# Day 3: Doping in Semiconductor Manufacturing Doping is a critical process in semiconductor manufacturing where impurities are intentionally introduced to the silicon wafer to modify its electrical properties. This process enhances the conductivity of silicon, enabling it to function effectively in electronic devices. There are two types of doping: - **n-type doping**: Adds elements like phosphorus or arsenic, which have extra electrons. - **p-type doping**: Incorporates elements like boron or gallium, which create "holes" (missing electrons). These doped regions form the essential building blocks of semiconductor devices, such as diodes and transistors, which are pivotal in modern electronics. Join us as we explore how doping transforms raw silicon into the intelligent circuits powering our gadgets. #Semiconductors #Doping #Electronics #TechInnovation #Manufacturing

#Day 28: The Role of Doping in Semiconductors Doping is a crucial process in semiconductor manufacturing, involving the intentional introduction of impurities into an intrinsic semiconductor to modify its electrical properties. There are two main types of doping: 1. **N-type Doping:** Adds impurities with more electrons than the semiconductor, typically using elements like phosphorus or arsenic in silicon. This creates an abundance of free electrons, enhancing conductivity. 2. **P-type Doping:** Introduces elements with fewer electrons, such as boron, creating "holes" or positive charge carriers. This also improves conductivity but through positive charge movement. Doping allows for the precise control of a semiconductor's conductivity, enabling the creation of essential components like diodes, transistors, and integrated circuits, which are the building blocks of modern electronic devices. Stay tuned as we continue to explore the fascinating world of semiconductors!

• #TSMC chart compares chip die size and total power consumption across different semiconductor technologies. As the technology node shrinks from 55nm to 3nm, both the die size and power consumption significantly decrease. For instance, at 55nm, the die size and power consumption are at their highest (normalized to 1), while at 3nm, the die size drops to 0.026, and power consumption to 0.015. This demonstrates the efficiency gains achieved with advanced manufacturing nodes, as smaller processes offer more compact, power-saving chip designs, crucial for modern applications like #Al and #HPC.