Taiwan Semiconductor’s Post

An insightful read! This story on our company blog helped me understand about the importance of general-purpose analog ICs are in today's electronics systems.

An insightful read! This story on our company blog helped me understand about the importance of general-purpose analog ICs are in today's electronics systems.

𝐅𝐏𝐆𝐀𝐬 𝐟𝐨𝐫 𝐕𝐢𝐝𝐞𝐨 𝐁𝐫𝐢𝐝𝐠𝐢𝐧𝐠 How silicon and circuit optimizations help FPGAs offer lower size, power, and cost in video bridging applications ... ... in this new article in Designing Electronics North America https://lnkd.in/en3pwTa6 Gowin Semiconductor Corp, RUTRONIK Electronics Worldwide

Space-Saving Op Amp Devices Deliver Strong Noise Performance With supply voltage between 1.8V and 5V being covered, the TLR377GYZ operational amplifiers (op amps) from ROHM Semiconductor Europe have a 137dB gain. These single-channel CMOS-based devices exhibit a low input offset voltage (down to 1mV), plus a typical 0.0005nA input bias current. Their common mode rejection ratio (CMRR) is 100dB. They are supplied in WLCSP format packages (with a diminutive 0.88mm x 0.58mm footprint). A -20°C to 85°C operational temperature range is... READ MORE https://lnkd.in/eQ4WfVAa Andreas Thamm Katrin Haasis-Schmidt Justine Hörmann Michael Maurer Melanie Schriefers Jana Falk Jun Shirai Dr. Prasad Bhalerao

Taiwan Semiconductor announced a family of 650V #siliconcarbide Schottky barrier diodes which are suitable for high-efficiency AC-DC, DC-DC and DC-AC conversion applications. Unlike silicon-based fast-recovery rectifiers, these #SiC devices have negligible switching losses due to low capacitive charge (QC). This makes them suitable for high-speed switching applications, benefitting circuit designs with increased power density and can reduce overall solution size.

POWR-SPEED High-Speed Fuses | Littelfuse   Littelfuse POWR-SPEED High-Speed Fuses are tailored for performance and efficiency to better safeguard important power semiconductors against short circuits. These fuses are specifically designed to have the short-circuit properties necessary for protecting semiconductor devices, such as low energy let-through (l2t), low peak currents (IPEAK), low-arc voltage and high heat dissipation. Learn More>>https://lnkd.in/grHcd8u3

Discover why you should consider the NHM1000 Magnetic Switch from NXP Semiconductors for your development needs. This recently launched switch is designed to meet the current market demands and offers varying capabilities, reliability and levels of innovation that can provide great insights in almost any industry. Read this informative blog to learn more!

【4th Generation 600V Super Junction MOSFETs】 Unleash the power within. Taiwan Semiconductor's 4th generation NE series MOSFETs supercharge your high-voltage designs. Experience a surge of efficiency with dramatically lower on-resistance and gate charge capacitance. This new releasing breaks the mold, delivering a 30% leap in figure-of-merit (FOM), empowering you to build smaller, faster and more efficient systems. Don't just power your creations, ignite them. More Info | https://twsemi.co/4MOSFET

Upcoming Webinar on the Future of EV Powertrains: Thursday 11 July 2024 - SiC, GaN, and the Evolution of Power Electronics. In this webinar, IDTechEx will summarize the current market landscape concerning the wide bandgap semiconductors SiC and GaN and other EV power electronics market trends. http://dlvr.it/T8hxLg

CEA-Leti announces launch of FAMES Pilot Line as part of EU Chips Act Initiative CEA-Leti has announced the launch of the FAMES Pilot Line, an ambitious project aimed at advancing semiconductor technologies in Europe as part of the EU Chips Act Initiative. The FLAMES pilot line will develop five new sets of technologies: FD-SOI (with new nodes at 10nm and 7nm), various types of embedded non-volatile memory (OxRAM, FeRAM, MRAM, and FeFETs), radio-frequency components (switches, filters, capacitors), two 3D integration options (heterogeneous and sequential), and small inductors for DC-DC converters in power management integrated circuits (PMICs). Jean-rené Lèquepeys, CTO of CEA-Leti, remarked, “The FAMES Pilot Line integrates cutting-edge technologies to create disruptive system-on-chip architectures, offering smarter, greener, and more efficient solutions for future chips. This project will address semiconductor sustainability challenges.” Jari Kinaret, Chips JU executive director, added, "The Chips Joint Undertaking is proud to support this strategic initiative, enhancing the EU’s sovereignty in a critical domain while fostering sustainability and collaboration among European actors." https://lnkd.in/eedrYJRk