Silanna Semiconductor’s Post

You’ve got in-depth questions regarding SiC or GaN designs? We will provide the answers to you – live at Bodo‘s WBG Expert Talk! On October 9, 2024 from 3 pm CEST, we will discuss recent articles on Wide Bandgap. During the SiC session, you will receive insights on "Engineered Substrates with ultra-low resistivity Polycrystalline SiC Base" from Gonzalo Picun, SOITEC. Ehab Tarmoom, Microchip Technology Inc., will provide "Design Considerations for a High-Voltage SiC-Based Battery Disconnect Switch", and Daniel Markus from Infineon Technologies will answer your questions on his contribution about "Sustainable Power Conversion in EVs with Wide-Bandgap Materials and Top-Side Cooling". After a short break, from 4:30 pm, Gallium Nitride is going to be our focus. Alex Lidow from EPC - Efficient Power Conversion will speak about several articles in 2024, including this months coverstory "The Role of Gallium Nitride Power Transistors and Integrated Circuits in the Emerging Humanoid Robot Market". Fraunhofer IAF's Michael Basler is one of the authors of "Towards Vertical GaN Power ICs" and will answer your questions on the very hot topic Vertical GaN. Last, but certainly not least, Simon Li from GaNPower International can say something about "Enhancing Reliability and Compatibility with Upgraded E-mode GaNFET". Registration is free at https://lnkd.in/dZ3AWug #powerelectronics #widebandgap #SiC #GaN

We are proud to have represented our institute at the 27th SPEEDAM conference in Ischia, Italy. With a delegation of 13 people, we were one of the largest German teams at this prestigious event. Alongside Prof. Axel Mertens and Prof. Bernd Ponick, we presented the latest findings of our research and engaged in fruitful discussions with industry experts. Here is a list of our publications, which will soon be available for download on IEEE Xplore: Christian Beckemeier: “Comparison of Input Voltages of Series Resonant Converters for Isolated Auxiliary Power Supply”   Cara Behrendt: “Optimization of hairpin winding schemes with respect to the common-mode current” Niklas Himker and Manon Fehse: “Reducing the Effect of Iron Losses on the Quality of Self-Sensing Control Based on Current Oversampling”   Niklas Himker: “Extension of low-speed self-sensing capability for induction machines by using an FPGA”   Rebecca Himker: “Differential-mode voltage components as degrees of freedom in the control of modular multilevel converters”   Jan Niclas Laumann: “Advanced control method for quasi-three-level operation of a conventional converter extended by a modular multilevel branch”   Malte Lorenz: “Predictive branch energy controller for a hybrid modular multilevel converter in quasi-three-level operation”   Tobias Manthey: “Yield and hot-spot analysis for replacing bypass diodes with PV module-integrated microinverters”   Constantin Schepe: “Rotor design measures to lower an induction machine's saturation-dependent anisotropy as a prerequisite for self-sensing control”   Marius Schubert: “Reduction of Eddy Current Losses in Additively Manufactured Synchronous Reluctance Rotors”   Mohamad Shheibar: “Transient overvoltage prediction of an inverter-fed electric machine”   Viktor Willich: “Impact of Interleaved Inverter Operation on the Machine Losses of Dual Three-Phase Synchronous Machines”   #IAL #LUH #SPEEDAM2024 #IEEE #ElectricDrives #PowerElectronics #AcademicResearch #Innovation #ElectricalEngineering

Don’t forget to register for next week’s webinar where we discuss the use of advanced materials to solve heat load challenges in the manufacture and packaging of semiconductor components. Hosted by @ASM International, this free session explores the use of materials that are highly efficient, light weight, enable longer field life cycles and offer the ability to operate across all climate conditions. Register to join us on Tuesday, July 23, at 11 a.m. EST: https://bit.ly/3Y1wVc8 #semiconductors #MaterialsScience #ElectronicsEngineering #EnablingWhatsNext

Scientists, designers and engineers came together recently to attend the IEEE WiPDA conference, co-hosted by Compound Semiconductor Applications (CSA) Catapult and Cardiff University / Prifysgol Caerdydd, to meet, collaborate and share ideas with one another. At the conference, a range of speakers and exhibitors showcased the international opportunities in power electronics 🌍 CSA Catapult showcased its unique offering of cutting-edge technology, expertise and capability, used to design and develop high-performing power electronics modules and converters for automotive, energy and industrial applications. 💬 Ingo Lüdtke, head of power electronics at CSA Catapult said, “We have established a good power module design, test and validation capability and we are moving to power converters.  “To fully exploit the benefits of compound semiconductors we will need to use AI. We hope to convert new ideas and future collaboration.” #Compound #Semiconductors #PowerElectronics #NetZero #Energy #SolidStateTransformers #WideBandgap #Renewable #SmartGrids #Collaboration #Technology #SuperCluster #Automotive #Aerospace

This week, we're highlighting the five Southwest Advanced Prototyping (SWAP) Hub projects that were awarded $29.6 million to strengthen the nation's chip-making capabilities and reduce dependency on foreign sources of microelectronics. These projects are among 33 projects across the nation awarded a total of $269 million under the bipartisan CHIPS and Science Act-funded Microelectronics Commons initiative, as announced by the United States Department of Defense during their visit to MacroTechnology Works at ASU. Project: Multi-MHz, High Density, Ultra-fast RADAR Power Converter Project team: Arizona State University, Sandia National Laboratories, Infineon Technologies, Lockheed Martin and ThermAvant® TECHNOLOGIES. This project will advance radar power systems in critical defense applications by developing a multi-megahertz, multi-kilowatt, high-density ultra-fast radar power converter that forms the heart of advanced radar systems. The converters will use gallium nitride-based switching devices that dramatically improve performance — including six times higher power density, 50% lower losses and ultra-fast response times. Read more: https://lnkd.in/gdX3k6kq NSTXL (National Security Technology Accelerator) Ira A. Fulton Schools of Engineering at Arizona State University ASU Knowledge Enterprise #CHIPSAct #SemiconductorManufacturing #SWAPHub #Microelectronics #DoD

Silicon carbide technologies could TRANSFORM European economies 🚀 The European project “Trusted European SiC Value Chain for a Greener Economy”, TRANSFORM for short, aims to build a resilient European supply chain for power electronics based on silicon carbide (SiC) technology 🔌 This is to be achieved through the collaboration of 33 partners from 7 European countries, including industrial companies, universities and research institutions. One of the partners of the project is Brno University of Technology (BUT, Vysoké učení technické v Brně), represented by researchers from CEITEC - Central European Institute of Technology, BUT, and the Faculty of Electrical Engineering and Communication (FEEC, Fakulta elektrotechniky a komunikačních technologií VUT v Brně) 🏫 „These semiconductor materials are able to operate at higher voltage and current loads with higher switching frequencies. They also have exceptional thermal and electrical properties,” explains Radimir Vrba, head of research and development at one of the demonstrators ⚡ Read more in our newly published article ⬇️ https://lnkd.in/efSAR7Mx #CEITECScience Bosch #Semiconductors #SiliconCarbide #PowerElectronics #research #brnoregion #czechrepublic

We are joining the sustainability efforts of the semiconductor industry with our new ambitious R&D project, RecoVal. By employing our Sofi Filter®, we target a 70% recovery of the valuable ceria used in polishing slurries. The ultimate target is ceria reuse and tools for resource efficiency for the growing semiconductor industry. 🌍 Chip Zero is an innovation ecosystem led by Picosun, an Applied Materials company and supported by Business Finland. Chip Zero aims to create the first semiconductor ecosystem in Finland with a mission to develop chips with zero lifetime emissions. The aim is to lower the deposition emissions of semiconductor manufacturing by 50% and increase the handprint of chips by double digit percentages by 2030, thus leading to an overall zero lifetime emission. #semiconductorindustry #chipzero #resourceefficiency

The economic contribution of Compound Semiconductor Applications (CSA) Catapult highlighted in the new report #semiconductorindustry #semiconductors #semiconductor #CSACatapult

Sudip K. Mazumder received a semiconductor research grant to help modernize the nation's power grid. Learn more about this crucial research at https://lnkd.in/ghbGAVjS #UIC #UICCollegeofEngineering #ElectricalEngineering

Our concept for a market novelty - more efficient and fail-safe industrial drives through #TinyML and #GaN semiconductors ⚙ From permanently operated production lines to electrified transportation – electric drives are the system’s centerpiece and therefore critical to failure as well as primarily responsible for efficiency. To get closer to the requirement for absolute reliability of electrical drives and the power semiconductors used to drive them, intelligent controllers require the capability to monitor and interpret the state of the system components in real time. In the strategic research project PowerCare (www.power-care.org), Fraunhofer will combine new, highly efficient GaN semiconductors and a AI-capable motor controller for integrated realtime failure monitoring. Have a look: https://lnkd.in/e_yuaRDM Fraunhofer-Institut für Mikroelektronische Schaltungen und Systeme IMS Fraunhofer IISB Fraunhofer ISIT