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Validating chip functions in just a few clicks? Without the hassle of driver libraries and BSPs? Wait, no code at all? Check out this quick video we filmed at electronicaFair last week, where we showcased Embedd.it's no-code tool for functional chip validation. Here’s how it works: 1. Upload a datasheet 2. Configure the component 3. Select a dev board 4. Connect the component to the dev board and your computer 5. Voilà – see live data from each register, complete with bit allocation breakdowns! (Better analytics and more insights are on the way.) Magic? It certainly feels like it. Hopefully, it makes life much easier for hardware engineers validating chips. Ping me if you’d like to become an early user! Credits to Jonathan Georgino for making it possible to shoot this (DJI Osmo is amazing). Plus a small easter egg of an upcoming integration on the table 😀

Tired of the hassle of validating chip functions? 👋 We've got you covered! Embedd.it's no-code tool streamlines the entire process. See how it works in this video, and feel free to reach out if you want to learn more!

Electric vehicle developers: How do you know your software is in compliance with key 🔑 automotive safety and security standards? Download our free white paper to learn how to get started with EV software compliance: https://ter.li/qiu0ti

Delve into the details of Mercury’s MP1501 Intelligent Controller with this info-packed datasheet and see what makes Mercury’s advanced hardware tick. Download the Datasheet 👇

Cooking Up Better Performance for Arm-Based SoCs - Read the Cadence Tech Talk article here>> https://ow.ly/o9RI50SiyWg

TE Connectivity’s Z-PACK HM-ZD Connector Portfolio provides data rates of up to 56 Gbp/s while retaining backwards compatibility with previous versions of the HM-ZD family to easier upgrades in the field. Designed for Advanced TCA next-generation applications including options for traditional and co-planar architectures, the Z-PACK HM-ZD product family is well suited for data center applications including servers and routers, as well as test/measurement, medical imaging devices and industrial automation. URL:

Who says recovery from Seagate Helium drives is not possible? Another helium-filled hard drive, the Seagate ST10000NE0008, landed on our desk recently. Another stack of wobbling platters, another pile of crashed heads, another damaged translator… From our experience, the weakest point of helium-filled hard drives is the increased weight of the platter stack, which adds more stress on the servo motor axis and makes these devices less shock-resistant than air-filled hard drives. Once the motor axis becomes uncentered, it leads to platters wobbling and potential damage to the platters, motor, and read/write heads. And, of course, there’s always special way to access to firmware of hard drive. The drive in question arrived in a very bad state with wobbling platters, crashed heads, and firmware damaged due to a previous head swap attempt. But, as we said, nothing is impossible, and after dealing with mechanical issues and repairing of damaged firmware, we successfully rescued 98% of the customer’s data. https://lnkd.in/dqkBk7Wh

Over the course of development, there are changes and additions to Ignition. This page highlights updates in each new version and lets you browse changes in previous versions. See what's new: https://bit.ly/4fB3Ytb

TE Connectivity’s Z-PACK HM-ZD Connector Portfolio provides data rates of up to 56 Gbp/s while retaining backwards compatibility with previous versions of the HM-ZD family to easier upgrades in the field. Designed for Advanced TCA next-generation applications including options for traditional and co-planar architectures, the Z-PACK HM-ZD product family is well suited for data center applications including servers and routers, as well as test/measurement, medical imaging devices and industrial automation. URL:

TE Connectivity’s Z-PACK HM-ZD Connector Portfolio provides data rates of up to 56 Gbp/s while retaining backwards compatibility with previous versions of the HM-ZD family to easier upgrades in the field. Designed for Advanced TCA next-generation applications including options for traditional and co-planar architectures, the Z-PACK HM-ZD product family is well suited for data center applications including servers and routers, as well as test/measurement, medical imaging devices and industrial automation. URL: