We are pleased to present #Pegatron5G scalable private network solution at #Intel booth 3.3, Hall 3 India Mobile Congress Our solution features Pegatron 5G Baseband Units, Fronthaul Multiplexers #FHM for seamless coverage & capacity management, and high-performance ORU. With wide scalability, our solutions offer the flexibility to meet diverse 5G network needs. Powered by Intel, our technology enables enterprises to unlock the potential of private #5G networks. Learn more: https://lnkd.in/gyPVMdAF
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The chip maker describes its Snapdragon X80 as 'Release 18-ready', which refers to 3GPP's upcoming 5G-Advanced standard. It is the first Snapdragon to integrate support for NB-NTN (NB-IoT for non-terrestrial networks) on the same chip. It also supports six-antenna (6xRx) architecture, and is also capable of aggregating six component carriers (6CC) on the downlink. It's worth touching on that 6CC carrier aggregation (CA) feature, because CA demonstrations have become a semi-regular occurrence lately, with various players in the US and Europe achieving respectable throughput using various combinations of frequencies, including 6CC in some instances. Qualcomm's name crops up in plenty of these stories, usually its role is provider of a prototype device.
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Setting up an embedded vision system becomes more easy these days as Framos joins forces with NXP to enable a smooth integration of the Framos Sensor Modules such as the new FSM:GO modules in processors like the i.MX8M Plus
New strategic collaboration! 🚀 We're proud to announce an exciting collaboration with NXP Semiconductors, aimed to simplify embedded vision device development! 🤝 In this synergistic collaboration, we joined NXP Semiconductors's i.MX 8M Plus applications processors ecosystem partners in empowering the market, with our ready-to-go optical sensor modules FSM:GO based on the latest SONY Starvis 2 sensor technology and our image processing expertise. Stay tuned for more updates on this dynamic partnership! 👉 https://lnkd.in/dAKfXTn5 #FRAMOS #NXP #EmbeddedVision
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It was an honor representing Renesas Electronics at TSMC open innovation platform ecosystem forum - High energy, 500+ people in the room, probably the same on phone. This tells us everything about how critical chiplet technology is to keep pushing at the frontiers of Moore’s law - how many new industries it will change, business models it will create - and new way of doing things it is leading to. The bigger the promise, the more is the engineering responsibility - it will take a village to get this right. Especially for automotive - the work in front of us is a broad span - At least the first 5 areas we are working intensely are - 1. New interconnect and SOC architecture 2. Achieving optimized software and dataflows for NUMA orchestration where memory space spans across devices with varying latencies 3. standardizing UCIe-S and advanced to achieve 10-20x better picoJoules per bit of data 4. developing new EDA flows needed for ensuring reliability - electrical and mechanical 5. functional safety of ASIL D class with complete freedom from interference Renesas, TSMC and many other friends working together to get this to production in the cars - very soon. Reach out to me - if you are interested in working at system level of architecture or packaging for chiplets in advanced nodes Reach out - if you have suggestions on collaborating and how we can do this better for the industry on the whole
Chiplet technology is helping accelerate Software-Defined Vehicle (SDV) innovation and shape the future of automotive intelligence. Recently, Aish Dubey, Vice President & General Manager of the High Performance Computing SoC Business Division at Renesas, gave an insightful keynote on the future of SDVs at TSMC’s Open Innovation Platform Ecosystem Forum in Tokyo. Learn more about our leading-edge automotive solutions: https://bit.ly/40CId84 #SoC #Chiplets #SDV #TSMCOIP2024
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Great presentation from Aish Dubey on #Chiplet and #SDV. Putting #AI in the car is commonly accepted by customers and the automotive industry. Let me know if you are interested in learning more about our software and AI solution with Renesas R-car #SoC
Chiplet technology is helping accelerate Software-Defined Vehicle (SDV) innovation and shape the future of automotive intelligence. Recently, Aish Dubey, Vice President & General Manager of the High Performance Computing SoC Business Division at Renesas, gave an insightful keynote on the future of SDVs at TSMC’s Open Innovation Platform Ecosystem Forum in Tokyo. Learn more about our leading-edge automotive solutions: https://bit.ly/40CId84 #SoC #Chiplets #SDV #TSMCOIP2024
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💎 Distinguished lecture with Anirban Bandyopadhyay, #IEEE Fellow and Senior Director and head of Strategic Applications within the End Market organization of GLOBALFOUNDRIES U.S. Inc., USA! He will present 𝐑𝐅 𝐓𝐞𝐜𝐡𝐧𝐨𝐥𝐨𝐠𝐢𝐞𝐬 𝐟𝐨𝐫 𝐧𝐞𝐱𝐭 𝐠𝐞𝐧𝐞𝐫𝐚𝐭𝐢𝐨𝐧 𝐨𝐟 𝐰𝐢𝐫𝐞𝐥𝐞𝐬𝐬 𝐜𝐨𝐧𝐧𝐞𝐜𝐭𝐢𝐯𝐢𝐭𝐲. 📆 June 12th at 5pm (CEST) 📍 Online - Zoom 💬 "We are approaching another inflection point of cellular communications with the #6G cellular standard to be launched by the end of this decade. The next generation of #wireless connectivity including both cellular and WiFi needs to address the key requirements of existing high data rate applications and emerging applications like AR/VR, telepresence etc. in a power efficient way. Other challenges are limited form factor, reasonable coverage and minimized dead zone. 💠 This talk will highlight the #hardware challenges of future wireless connectivity and how innovations in #RF technologies can address the above challenges citing examples of technology differentiation covering both #Silicon and III-V." Info & Registration ➡ https://lnkd.in/eDU_SDYF
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🔍 Unearth the next wave of semiconductor innovation! Chat with our very own Sergio Timpretti and NXP Semiconductors' Justin Mortimer about the game-changing MCX MCU series and the future of the industry. Get the inside scoop here 👉 https://bit.ly/3x4Wu0V #NXP #MCX #MCU #Technology #Microcontrollers
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Check out this one-minute breakdown of three things to know about Intel Gaudi 3 Al accelerators. #IAmIntel https://bit.ly/4dytI81
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Understand and leverage the full potential of the i.MX 95 Apps Processor's NPU! Join NXP Semiconductors and Toradex on September 12th for a webinar that dives deep into optimization techniques, vision pipeline analysis, and real-world performance. You'll also learn how to seamlessly integrate with our ecosystem and elevate your projects. Don't miss it! Sign up now: https://bit.ly/3SNSUjn NXP Partner Channel #iMX95 #VisionAI #MachineLearning #NPU #NeuralProcessingUnit #NXP #NXPpartner #AIOptimization #EmbeddedVision
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#SKhynix, #TSMC, and #NVIDIA Reportedly Forge Alliance to Develop Next-Generation #HBM Memory leader #SKHynix is forging a closer partnership with industry giants #TSMC and #NVIDIA, according to a BusinessKorea report. The announcement is expected at the upcoming Semicon Taiwan exhibition in September. This collaboration builds upon a long-standing relationship between SK Hynix and TSMC. In 2022, TSMC established the OIP #3DFabric Alliance, specifically targeting partnerships in memory and packaging technologies. During the alliance launch, SK Hynix emphasized its close cooperation with TSMC on previous and current high-bandwidth memory (#HBM) iterations. This collaboration ensures compatibility with CoWoS processes and HBM interconnectivity. Check full insights via the link below https://lnkd.in/gkY7_Tmf
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#Altera, which is part of Intel, is set to implement a price increase starting November 24, 2024. This decision comes as the company is looking to navigate through financial challenges and improve revenue streams, particularly given the significant decline in revenue reported in recent quarters --------- -7% increase on Cyclone10 GX/LP, CycloneV, CycloneIV, MAX10, and MAXV -10% increase on Agilex7, Agilex9 ,Stratix10, Arria10 -20% increase on all Stratix V, Stratix IV, Stratix III, Arria V, ArriaII, Cyclone III, Cyclone II,MAX II, and EPCQ #Altera #Intel #ELECTRONICCOMPONENT #FPGA #IC #Adaptability #CostManagement #CustomerCommunication #MarketPositioning #EconomicAwareness
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