Viktoras Jucikas’ Post

𝐒𝐊 𝐡𝐲𝐧𝐢𝐱 𝐒𝐞𝐜𝐮𝐫𝐞𝐬 $𝟒𝟓𝟖 𝐌𝐢𝐥𝐥𝐢𝐨𝐧 𝐒𝐮𝐛𝐬𝐢𝐝𝐲 𝐭𝐨 𝐁𝐨𝐥𝐬𝐭𝐞𝐫 𝐔.𝐒. 𝐀𝐈 𝐂𝐡𝐢𝐩 𝐏𝐫𝐨𝐝𝐮𝐜𝐭𝐢𝐨𝐧 SK hynix Inc. has been awarded $458 million in subsidies from the U.S. government to enhance semiconductor production capabilities within the United States. This funding, announced by the U.S. Department of Commerce under the CHIPS Act, is part of a national effort to expand domestic chip manufacturing and secure supply chains for advanced technologies. The subsidy follows a thorough review process initiated after the preliminary memorandum of terms (PMT) signed in August 2024. 𝐑𝐞𝐚𝐝 𝐌𝐨𝐫𝐞: https://lnkd.in/gUXqckG6 #SKhynix #AIchip #ChipProduction #USManufacturing #TechNews #Subsidy #AIInnovation #Semiconductors #Investment #FutureTechnology #USTech #EconomicGrowth #SustainableTech #TechInvestment #ArtificialIntelligence #TechIndustry #DigitalTransformation #GlobalCompetitiveness #ChipManufacturing

As Tokyo Electron navigates these changes, its growth prospects signal an opportunity for investors to keep a close eye on the company. Subscribe to Avestix Intell to receive more in-depth updates about TEL and other key Japanese companies shaping the global market. Join now for exclusive insights -> https://lnkd.in/gPRbHGCz #Avestix #AVXI #Japan #GlobalMarket #InvestmentInsights

NEWS: Silicon Europe announces that Frank Bösenberg, Managing Director of Silicon Saxony, will take over as chairman of the Silicon Europe Alliance for 2025. Frank will focus on advancing Europe’s #semiconductor industry, aligning efforts with the EU Chips Act and EU Digital Agenda. Ola Svedin, CEO of OpenTech, will continue as co-chair, collaborating with Frank and other European leaders to strengthen partnerships and address global challenges in the semiconductor and #electronics sectors. Read more via Silicon Europe Alliance: https://lnkd.in/d6ZqHwJh

🇪🇺 How can we enhance EU's production capacities in #semiconductor manufacturing, advanced packaging, test, and assembly and ensure a secure position in the #SupplyChain? 🌐 This is a central point of discussion for the #WorkingGroup on Supply Chain launched by the #Alliance on Processors and Semiconductor Technologies. 👏 We thank the co-chairs Carlos Pardo (Asociación Española de la Industria de Semiconductores - AESEMI) and Hans Ehm (Infineon Technologies) for guiding the discussion and all members for contributing with their expertise. The Working Group brings together industry, RTOs, associations, research and is open to new members who want to collaborate and have a voice in strengthening the European semiconductor ecosystem. For more details on how to become member of the Alliance and join the Working Group 👉 https://lnkd.in/dwzkAvqA

Thank you, Design And Reuse, for publishing our keynote video on "Charting the AI-Powered Transformation in the Semiconductor Industry", by our Founder & CEO Sivakumar P R. Watch the video to learn about our incredible journey in the #semiconductorindustry and how we illuminate our path forward continuing this journey in the #AI era with processor innovation using #RISCV open ISA.

One of the unique advantages of the PulseForge, Inc. tools is the very large working distance. This feature eliminates the need for precision focus alignment for most applications. We recently had a customer of #PhotonicDebonding with highly warped bonded device pairs – exhibiting a few millimeters of warpage. We were able to go through the debonding step in a single pass within few seconds and no changes to the working distance within the pass. Device yield was not impacted by the debonding step. Controlling warpage is essential to ensure high yield and reliability in semiconductor manufacturing. Sometimes, however, reducing the warpage is not economically or technically feasible. Warpage becomes an even bigger player in panel level applications of advanced packaging. This is where photonic debonding shines. The PulseForge tools provide a novel path for processing with high yield and circumventing the negative attributes of warpage. I highly encourage attending the Heterogeneous Integration submit going on today in Taipei as part of the #SEMICON Taiwan 2024 conference. https://lnkd.in/gWBzrqZn My colleague, Vikram Shreeshail Turkani, will be speaking on various advantages of photonic debonding. Go find him and let him know what temporary bonding and deboning (#TBDB) challenges you’re facing. 

The NanoIC pilot line plays a key role in accelerating innovation, driving economic growth, and helping to realize the EU Chips Act vision. This initiative aligns with the EU Chips Act's mission to strengthen Europe’s technological leadership in the semiconductor industry. With a projected contribution of €1.4B from the Flemish government (Belgium) and EU funding programs (through the Chips Joint Undertaking ), we are poised to create a leading technology platform for companies worldwide. Follow us for updates or visit our website: https://lnkd.in/e7JDvRcG #NanoIC #EUChipsAct"

WHY THE PITC IS SO IMPORTANT AS EXPLAINED IN JAPAN. I often bump into my good friend and colleague Sylwester Latkowski, the CTO of Optica corporate member PITC - Photonic Integration Technology Center based in the Netherlands. A week ago, as part of the Brabant Innovation Day summit in Tokyo Japan, Sylwester gave an excellent briefing to a packed audience of Japanese high-tech corporates. His concise presentation of the challenges and opportunities ahead deserves a much wider audience. The video has just been made public, and if you are curious as to why the PITC is so important for the test and reliability for integrated photonics in high volume manufacturing, then I recommend you spend the 20 minutes watching it. They are also looking for partners. The Dutch Province of North Brabant (Provincie Noord-Brabant ) gets the credit for organising the event at the Okura Hotel in Tokyo. https://lnkd.in/dbevuvhb Integrated photonics holds significant promise for addressing societal challenges, such as energy-efficient optical and wireless communication networks, advanced health monitoring, AI loaded data-center infrastructure by integrating light technology with traditional electronics. However, its widespread adoption is hindered by lengthy product development cycles and limited production throughput. To tackle these issues, especially in an age of rapid AI development, the Photonic Integration Technology Center (PITC) has launched four technology program lines to accelerate scale-up and industrial adoption of photonics. The PITC Metrology program focuses on developing next-generation test and measurement technologies. By increasing the accuracy, speed, and scalability of testing processes in both chip design and manufacture, the Metrology program seeks to increase testing throughput by a factor of ten, thereby enabling faster and more reliable production of photonic chips in high-volume manufacturing (HVM), at desired yields.

Great to see Sylwester CTO of PITC sharing our work on PhotonicLEAP, aiming at standardising PIC design and testing. Particular work on glass interposer based PIC packaging is aimed at reducing cost of optical assemblies by more than 10 times.

📰 News Highlight | U.S. BIS Adds 140 Companies to Entity List The U. S. Department of Commerce’s Bureau of Industry and Security (BIS) has officially updated the Export Administration Regulations (EAR), adding 140 companies to its Entity List, as published in the Federal Register. These 140 companies cover the entire semiconductor industry supply chain, affecting leading enterprises across various segments. This includes: 🔸 EDA companies: Empyrean Technology, GWX Technology, and Dongfang Jingyuan Electron Co., Ltd. 🔸Semiconductor equipment, materials, and component manufacturers: 20 firms such as NAURA, Kingsemi, Piotech, Skyverse, Zhichun, Kaishitong, Hwa Tsing Xinsheng and others, along with their subsidiaries. 🔸FABs: SMIC, Wuhan Xinxin, Si’En Qingdao, and two FABs based in Shenzhen. Primary Objectives of BIS’s New Regulations: 1️⃣ Restrict advancements in China’s AI development and prevent military technology progress. 2️⃣ Weaken China’s semiconductor ecosystem and prevent it from making technological breakthroughs at the expense of the security interests of the United States and its allies. Refer to the link below for the 140 companies in the Entity List: https://lnkd.in/gZjZb2vh iSTART-TEK #EntityList #chip #semiconductor #EDA #BIS #US